We sincerely invite you to attend IME2026 Shanghai Microwave Exhibition | Corevo XCPS debuts, explor

The 19th China International Microwave and Antenna Technology Exhibition (IME2026) will be held at the Shanghai World Expo Exhibition and Convention Center from October 20–22. Corevo Technology sincerely invites new and old customers, industry peers, and investment partners to visit Booth 453 for face-to-face exchanges of technical ideas and to explore new possibilities for industrial cooperation.

As a highly influential professional exhibition in the domestic RF microwave and antenna field, IME is not only a window for product display, but also a core platform for technical deliberation, supply-demand matching, and capital dialogue. This edition covers an exhibition area of 12,000㎡, bringing together over 200 leading enterprises from domestic and international industry chains, and is expected to welcome more than 6,000 professional visitors from home and abroad, spanning cutting-edge tracks such as communications, radar, commercial aerospace, and millimeter-wave electronics. Multiple concurrent technical forums will focus on hot topics like millimeter waves, 5.5G/6G, and phased array antennas, gathering engineers, system integrators, research institutions, and industrial capital, making it a high-quality platform for capturing industry trends up close and connecting upstream and downstream resources.

At this exhibition, Corevo brings its core XCPS cross-linked polystyrene series of physical exhibits. As a broadband, low-loss special dielectric material, XCPS has achieved independent domestic large-scale production, benchmarking against leading overseas products and breaking the long-standing reliance on imported high-end microwave dielectric materials.

The material maintains a stable dielectric constant of 2.5, with a dielectric loss as low as 0.0005, combining core advantages such as ultra-low high-frequency loss, lightweight construction, radiation resistance, and ease of processing. It is available in various forms including sheets, rods, rings, and custom shapes, suitable for microwave, millimeter-wave, and even terahertz broadband applications, offering a brand-new material selection approach for high-frequency system design.

The application boundaries of XCPS materials continue to expand, covering multiple strategic emerging fields:

✅ Communications: dielectric components for 5.5G/6G base stations, wave-transparent parts for automotive millimeter-wave radar, high-frequency and ultra-high-frequency antennas and devices, etc.;

✅ Aerospace and military: dielectric components for satellite-borne and airborne radomes and phased array antennas, supporting lightweight and high-reliability requirements in commercial aerospace and radar equipment;

✅ Cutting-edge research: insulation structural parts for controlled nuclear fusion, acoustic lenses for medical ultrasound, and other high-end scenarios.

The products have already entered the supply chain validation phase of several leading equipment manufacturers, steadily advancing the adoption of domestic materials.

At Corevo Technology Booth 453, you can closely examine XCPS physical samples and learn about the key parameters of the material on site. The Corevo Technology team will be present throughout the event, ready for in-depth discussions on material selection, processing techniques, custom development, and supply chain implementation. Whether it is project collaboration, joint technical development, or industrial investment exchanges, you are all welcome to come and talk.

From October 20–22, at the Shanghai World Expo Exhibition and Convention Center, Corevo Technology Booth 453 awaits your visit, together exploring the broad future of domestic substitution for broadband, low-loss new materials!