Refuse cold flow deformation! Domestic XCPS breaks through with rigidity, safeguarding millimeter-wa

As a core fundamental component operating at frequencies above 100 MHz, RF connectors with high-end specifications can support frequency bands up to 110 GHz and beyond. They are key components in high-frequency scenarios such as 5.5G base station AAUs, automotive 77 GHz millimeter-wave radars, and low-orbit satellite K/Ka-band phased arrays. Among these, the insulating support medium of mid-to-high-frequency connectors directly determines signal transmission stability and long-term service reliability, and its performance is critical to characteristic impedance matching accuracy and overall system efficiency.

Although polytetrafluoroethylene (PTFE) has become the mainstream insulating medium for RF connectors due to its low dielectric constant and low loss characteristics, it has inherent defects in precision connector applications. Research from the Johns Hopkins University Applied Physics Laboratory (JHU APL) 'RF Connector Technology Review' indicates that PTFE exhibits creep (cold flow) characteristics even at room temperature and undergoes a first-order phase transition in the 18~25°C range, with a volume change rate of 1.0%~1.8%, leading to three types of application risks:

First, long-term compression causes dimensional drift of the insulating support, disrupting 50Ω characteristic impedance matching and increasing the signal reflection coefficient.

Second, insufficient dimensional stability across temperature zones makes it difficult to adapt to conditions such as day-night temperature differences in outdoor base stations and temperature changes during vehicle radar start-stop cycles.

Third, stress relief annealing treatment is required after machining; otherwise, stress release can lead to secondary dimensional deviations, significantly increasing the difficulty of production yield control.

XCPS cross-linked polystyrene, independently developed by Corevo Technology, is a specialty thermosetting engineering plastic designed to address the aforementioned pain points. Verified by third-party testing, its core performance is excellent: dielectric constant (Dk) is 2.5 (with no significant fluctuation across the 1MHz~500GHz frequency band), dissipation factor (tanδ) is 0.0005, density is 1.05 g/cm³, 24h water absorption rate is <0.06%, and dielectric performance shows no drift after 1000h of boiling water immersion. Under normal load, there is no cold flow or plastic deformation, with rigidity stable in the -70~110°C range. Internal stress has been eliminated during the preparation stage, requiring no annealing treatment before or after machining. Machining tolerances can be stably controlled at the 0.0001 level, dielectric strength is >45 kV/mm, and resistance to ionizing radiation reaches 10⁶ Gy.

The above performance makes it precisely suitable for RF connector applications: it can serve as the insulating support for mainstream connectors such as SMA and N-type (up to 20 GHz), solving the impedance drift problem caused by PTFE cold flow; it can be used as the inner dielectric of coaxial cables, balancing low loss with long-term dimensional stability; it can also serve as substrates for microwave lenses, microstrip antennas, and filters, meeting wideband dielectric stability requirements.

[Technical Note] The core application scenarios of XCPS are mid-to-high-frequency insulating supports and microwave components, and it does not have a direct substitution relationship with PTFE media.

According to data from Bishop & Associates, the global RF connector market size is expected to reach $3.71 billion in 2025 and grow to $7.79 billion by 2035, with a compound annual growth rate (CAGR) of 7.7%. Among these, the coaxial connector segment has a CAGR of 9.0%, ranking second in growth rate among connector categories. Based on industry analysis, the industry will develop in four major directions over the next five years: First, higher frequencies, with demand for 110 GHz and above specifications growing rapidly with 5.5G/6G deployment and satellite internet construction; second, miniaturization, with the share of small-sized specifications such as 2.92mm K-type and 1.0mm continuing to increase; third, high performance, with low passive intermodulation (PIM), high phase stability, and integrated filtering/attenuation functions becoming core competitive indicators; fourth, supply chain localization, with domestic communication equipment manufacturers and automotive OEMs showing continuously increasing demand for independent control of core materials.

The incremental market space for XCPS cross-linked polystyrene in the communications sector is concentrated in three major areas: 5.5G/6G base station AAU modules, where increased link density drives demand for mid-to-high-frequency connectors, filter substrates, and antenna supports; automotive 77GHz/79GHz millimeter-wave radars, where the penetration rate of ADAS promotes the localization of radomes, antenna substrates, and connector insulation components; and low-orbit satellite phased array systems, where the high requirements for wide-temperature dielectric stability, radiation resistance, and low outgassing in K/Ka-band satellite-borne applications provide a clear substitution space for XCPS.

Corevo Technology has深耕 the R&D and industrialization of XCPS, establishing a full-chain independent and controllable capability from polymerization process to finished product delivery. Key progress is as follows:

Process breakthroughs lay the foundation.Relying on a self-developed zero-initiator polymerization process, the purification bottleneck of polymer materials has been overcome, achieving stable and controllable material bulk purity and batch-to-batch consistency. Product core performance indicators benchmark against the international standard Rexolite® 1422 series, fundamentally solving pain points such as long delivery times for imported materials (typically over 3 months) and supply chain vulnerability.

Comprehensive product matrix meets all dimensional needs.A standardized supply system has been established: sheets cover standard sizes of 305×305mm and 610×610mm (thickness 5~100mm), with oversized sheets of 1000×1500×650mm included in regular stock; rods achieve full-size customized supply from φ5 to 150mm; large-size insulation rings of φ1000~3500mm are delivered stably, meeting multi-level needs from precision components to large-scale equipment. Films, adhesives, modified materials, and customized development services are also offered simultaneously, achieving comprehensive coverage from basic materials to functional applications.

Verification and implementation enter core tracks.XCPS has passed rigorous verification by several leading communication equipment manufacturers, with pilot production lines achieving stable small-batch supply. Application verification in high-barrier scenarios such as automotive 77GHz radomes and satellite-borne dielectrics is progressing in an orderly manner, marking its accelerated entry into the high-end manufacturing supply chain.

Capacity expansion and efficiency improvement ensure delivery capability.With the completion of market verification, batch orders are growing steadily, and some major customers have completed verification and locked in procurement needs. Based on predictions of market growth, Corevo has initiated capacity expansion plans. By optimizing production line layouts and improving production efficiency, the company is comprehensively enhancing delivery capability to ensure on-time delivery and quality stability.

Currently, the localization substitution of XCPS has steadily moved from sample verification to the batch delivery stage. Its excellent performance and full-chain independent and controllable capabilities not only solve the industry problems of high-frequency connector manufacturers' dependence on imports and unstable delivery times but also provide cost-effective material solutions and customized machining services for customers in fields such as communications, aerospace, and nuclear fusion.

Driven by emerging industries such as 5.5G/6G, intelligent connected vehicles, and low-orbit satellites, the explosive growth of the mid-to-high-frequency RF connector market brings broad space for XCPS. Corevo will continue to deeply cultivate material R&D and process optimization, improve the product matrix, enhance delivery efficiency, empower high-quality industry development with domestic high-end materials, and assist in the independent and controllable construction of the core electronic component supply chain.