Refuse cold flow deformation! Domestic XCPS breaks through with rigidity, safeguarding millimeter-wa

As a core fundamental component operating at frequencies above 100MHz, RF connectors, with high-end specifications supporting up to 110GHz and beyond, are key components in high-frequency scenarios such as 5.5G base station AAUs, automotive 77GHz millimeter-wave radars, and low-orbit satellite K/Ka-band phased arrays. Among these, the insulating support medium of mid-to-high frequency connectors directly determines signal transmission stability and long-term service reliability, and its performance is critical to characteristic impedance matching accuracy and overall system efficiency.

Although polytetrafluoroethylene (PTFE) has become the mainstream insulating medium for RF connectors due to its low dielectric constant and low loss characteristics, it has inherent defects in precision connector applications. Research by the Johns Hopkins University Applied Physics Laboratory (JHU APL) in the "RF Connector Technology Review" indicates that PTFE exhibits creep (cold flow) characteristics even at room temperature and undergoes a first-order phase transition in the 18~25°C range, with a volume change rate of 1.0%~1.8%, leading to three types of application risks:

First, dimensional drift of the insulating support after long-term compression, disrupting 50Ω characteristic impedance matching and increasing the signal reflection coefficient;

Second, insufficient dimensional stability across temperature ranges, making it difficult to adapt to conditions such as diurnal temperature variations in outdoor base stations and temperature changes during the start-stop cycles of vehicle-mounted radars;

Third, stress relief annealing treatment is required after machining; otherwise, stress release will lead to secondary dimensional deviations, significantly increasing the difficulty of production yield control.

Kairuivo TechnologySelf-developed XCPSCross-linked Polystyreneis a special thermosetting engineering plastic developed to address the aforementioned pain points. Verified by third-party testing, its core performance is excellent: dielectric constant (Dk) is 2.5 (no significant fluctuation in the 1MHz~500GHz frequency range), dissipation factor (tanδ) is 0.0005, density is 1.05g/cm³, 24h water absorption rate is <0.06%, and dielectric performance shows no drift after 1000h of boiling water immersion; no cold flow or plastic deformation under normal load, rigid stability in the -70~110°C range, and internal stress has been eliminated during the preparation stage, requiring no annealing treatment before or after machining. Machining tolerances can be stably controlled at the 0.0001 level, dielectric strength >45kV/mm, and resistance to ionizing radiation dose up to 10⁶ Gy.

The above performance makes it precisely suitable for RF connector applications: it can serve as the insulating support for mainstream connectors such as SMA and N-type within 20GHz, solving the impedance drift problem caused by PTFE cold flow; it can be used as the inner dielectric of coaxial cables, balancing low loss with long-term dimensional stability; it can also be used as substrates for microwave lenses, microstrip antennas, and filters, meeting the requirements for broadband dielectric stability.

【Technical Note】XCPSThe core application scenarios are mid-to-high frequency insulating supports and microwave components, and it does not have a direct substitution relationship with PTFE dielectric.

According to data from Bishop & Associates, the global RF connector market size is expected to reach $3.71 billion in 2025 and increase to $7.79 billion by 2035, with a compound annual growth rate (CAGR) of 7.7%; among these, the coaxial connector segment has a CAGR of 9.0%, ranking second among connector categories. Combined with industry analysis, the industry will develop along four major directions in the next five years: First, higher frequencies, with demand for 110GHz and above specification products growing rapidly with the deployment of 5.5G/6G and satellite internet construction; Second, miniaturization, with the share of small form factors like 2.92mm K-type and 1.0mm connectors continuously increasing; Third, high performance, with low passive intermodulation (PIM), high phase stability, and integrated filtering/attenuation functions becoming core competitive indicators; Fourth, supply chain localization, with domestic communication equipment manufacturers and automotive OEMs showing continuously rising demand for the independent controllability of core materials.

The incremental market space for XCPS cross-linked polystyrene in the communications market is concentrated in three major areas: 5.5G/6G base station AAU modules, where increased link density drives demand for mid-to-high frequency connectors, filter substrates, and antenna supports; automotive 77GHz/79GHz millimeter-wave radars, where the increasing penetration rate of ADAS promotes the localization substitution of radomes, antenna substrates, and connector insulation components; and low-orbit satellite phased array systems, where the stringent requirements for wide-temperature dielectric stability, radiation resistance, and low outgassing in K/Ka-band spaceborne applications provide a clear substitution space for XCPS.

Kairuivo Technology is deeply engaged in the R&D and industrialization of XCPS, having established full-chain independent controllability from polymerization process to finished product delivery. Key progress is as follows:

Process breakthroughs lay a solid foundation.Relying on the independently developed zero-initiator polymerization process, it has broken through the purification bottleneck of polymer materials, achieving stable and controllable material bulk purity and batch-to-batch consistency. Product core indicators benchmark against the international standard Rexolite® 1422 series, fundamentally solving pain points such as long lead times for imported materials (typically over 3 months) and susceptibility to supply chain disruptions.

Complete product matrix covers all-dimensional needs.A standardized supply system has been established: plates cover conventional sizes of 305×305mm and 610×610mm (thickness 5~100mm), with super-large plates of 1000×1500×650mm included in regular stock; rods achieve full-size customized supply from φ5 to 150mm; large-size insulation rings of φ1000~3500mm are delivered stably, meeting multi-level needs from precision components to large-scale equipment. Simultaneously, films, adhesives, modified compounds, and custom development services are launched, achieving comprehensive coverage from basic materials to functional applications.

Verification landing enters core赛道.XCPS has passed rigorous verification by several leading communication equipment manufacturers, with a pilot production line achieving small-batch stable supply; application verification in high-barrier scenarios such as automotive 77GHz radomes and spaceborne dielectrics is progressing orderly, marking its accelerated introduction into the high-end manufacturing supply chain.

Capacity expansion enhances delivery capability.As market verification is completed, batch orders are growing orderly, with some major customers completing verification and locking in procurement needs. Based on the forecast of market growth, Kairuivo has initiated capacity expansion plans, optimizing production line layout and improving production efficiency to comprehensively enhance delivery capability, ensuring on-time delivery and stable quality.

Currently, the localization substitution of XCPS has steadily moved from sample verification to the batch delivery stage. Its excellent performance and full-chain independent controllability not only solve the industry problems of import dependence and unstable lead times for high-frequency connector manufacturers but also provide high-performance material solutions and customized machining services for customers in fields such as communications, aerospace, and nuclear fusion.

Driven by emerging industries such as 5.5G/6G, intelligent connected vehicles, and low-orbit satellites, the explosive growth of the mid-to-high frequency RF connector market brings vast opportunities for XCPS. Kairuivo will continue to deepen material R&D and process optimization, improve the product matrix, enhance delivery efficiency, empower high-quality industry development with domestic high-end materials, and contribute to the construction of an independently controllable supply chain for core electronic components.