Refuse cold flow deformation! Domestic XCPS breaks through with rigidity, safeguarding millimeter-wa

As a core fundamental component with an operating frequency covering above 100MHz, high-end specifications of RF connectors can support frequencies up to 110GHz and beyond. They are key components in high-frequency scenarios such as 5.5G base station AAUs, automotive 77GHz millimeter-wave radars, and low-orbit satellite K/Ka-band phased arrays. Among these, the insulating support medium of mid-to-high-frequency connectors directly determines signal transmission stability and long-term service reliability, and its performance is crucial for characteristic impedance matching accuracy and overall system efficiency.

Although Polytetrafluoroethylene (PTFE) has become the mainstream insulating medium for RF connectors due to its low dielectric constant and low loss characteristics, it has inherent defects in precision connector applications. According to the 'RF Connector Technology Overview' study by the Johns Hopkins University Applied Physics Laboratory (JHU APL), PTFE exhibits creep (cold flow) characteristics even at room temperature, and undergoes a first-order phase transition in the 18~25°C range, with a volume change rate of 1.0%~1.8%, leading to three types of application risks:

First, long-term compression causes dimensional drift of the insulating support, destroying the 50Ω characteristic impedance matching and increasing the signal reflection coefficient.

Second, insufficient dimensional stability in cross-temperature scenarios makes it difficult to adapt to conditions such as diurnal temperature variations in outdoor base stations and temperature changes during the start-stop cycles of vehicle-mounted radars.

Third, stress relief annealing treatment is required after machining; otherwise, stress release will lead to secondary dimensional deviations, significantly increasing the difficulty of production yield control.

Keruiwo TechnologySelf-developed XCPSCross-linked Polystyreneis a special thermosetting engineering plastic developed to address the aforementioned pain points. Verified by third-party testing, its core performance is excellent: dielectric constant (Dk) is 2.5 (no significant fluctuation in the 1MHz~500GHz frequency band), dissipation factor (tanδ) is 0.0005, density is 1.05g/cm³, 24h water absorption rate is <0.06%, and dielectric performance shows no drift after 1000h of boiling water immersion; no cold flow or plastic deformation under normal load, rigid stability in the -70~110°C range, and internal stress has been eliminated during the preparation stage, requiring no annealing treatment before or after machining. Processing tolerances can be stably controlled to the 0.0001 level, dielectric strength >45kV/mm, and resistance to ionizing radiation dose reaches 10⁶ Gy.

The above performance makes it precisely suitable for RF connector scenarios: it can serve as the insulating support for mainstream connectors such as SMA and N-type within 20GHz, solving the impedance drift problem caused by PTFE cold flow; it can be used as the inner dielectric of coaxial cables, balancing low loss with long-term dimensional stability; it can also serve as substrates for microwave lenses, microstrip antennas, and filters, meeting the requirements for broadband dielectric stability.

【Technical Note】XCPSCore application scenarios are mid-to-high-frequency insulating supports and microwave components, and it does not have a direct substitution relationship with PTFE dielectric.

According to data from Bishop & Associates, the global RF connector market size is expected to reach $3.71 billion in 2025 and increase to $7.79 billion by 2035, with a compound annual growth rate (CAGR) of 7.7%; among these, the coaxial connector sub-segment has a CAGR of 9.0%, ranking second among connector categories. Based on industry analysis, the industry will develop along four major directions in the next five years: First, high-frequency development, with demand for 110GHz and above specification products growing rapidly with 5.5G/6G deployment and satellite internet construction; Second, miniaturization, with the proportion of miniaturized specifications such as 2.92mm K-type and 1.0mm continuously increasing; Third, high performance, with low passive intermodulation (PIM), high phase stability, and integrated filtering/attenuation functions becoming core competitive indicators; Fourth, supply chain localization, with domestic communication equipment manufacturers and vehicle manufacturers showing continuously increasing demand for the independent controllability of core materials.

The incremental market space for XCPS cross-linked polystyrene in the communications sector is concentrated in three major areas: 5.5G/6G base station AAU modules, where increased link density drives demand growth for mid-to-high-frequency connectors, filter substrates, and antenna supports; automotive 77GHz/79GHz millimeter-wave radars, where the increasing penetration rate of ADAS promotes the localization substitution of radomes, antenna substrates, and connector insulation components; low-orbit satellite phased array systems, where the high requirements for wide-temperature dielectric stability, radiation resistance, and low outgassing in K/Ka-band satellite-borne scenarios provide a clear substitution space for XCPS.

Keruiwo Technology is deeply engaged in the R&D and industrialization of XCPS, having established a full-chain independent controllable capability from polymerization process to finished product delivery. Key progress is as follows:

Process breakthroughs lay a solid foundation.Relying on the self-developed zero-initiator polymerization process, the purification bottleneck of polymer materials has been broken through, achieving stable and controllable material bulk purity and batch-to-batch consistency. Product core indicators benchmark against the international standard Rexolite® 1422 series, fundamentally solving pain points such as long lead times for imported materials (conventionally over 3 months) and susceptibility to supply chain disruptions.

Complete product matrix covers all-dimensional needs.A standardized supply system has been established: sheets cover conventional sizes of 305×305mm and 610×610mm (thickness 5~100mm), with oversized sheets of 1000×1500×650mm included in regular stock; rods achieve customized supply for all sizes from φ5~150mm; large-sized insulation rings of φ1000~3500mm are delivered stably, meeting multi-level needs from precision components to large equipment. Concurrently, films, adhesives, modified materials, and customized development services are launched, achieving comprehensive coverage from basic materials to functional applications.

Verification lands and enters core tracks.XCPS has passed rigorous verification by several leading communication equipment manufacturers, with a pilot production line achieving small-batch stable supply; application verification in high-barrier scenarios such as automotive 77GHz radomes and satellite-borne dielectrics is progressing orderly, marking its accelerated introduction into the high-end manufacturing supply chain.

Capacity expansion and efficiency improvement ensure delivery capability.With the completion of market verification, batch orders are growing orderly, and some major customers have completed verification and locked in procurement demands. Based on the forecast of market growth, Keruiwo has initiated a capacity expansion plan, comprehensively improving delivery capability by optimizing production line layout and enhancing production efficiency, ensuring on-time delivery and stable quality.

Currently, the localization substitution of XCPS has steadily moved from sample verification to the batch delivery stage. Its excellent performance and full-chain independent controllable capability not only solve the industry challenges of import dependence and unstable lead times for high-frequency connector manufacturers but also provide high-cost-performance material solutions and customized machining services for customers in fields such as communications, aerospace, and nuclear fusion.

Driven by emerging industries such as 5.5G/6G, intelligent connected vehicles, and low-orbit satellites, the explosive growth of the mid-to-high-frequency RF connector market brings vast opportunities for XCPS. Keruiwo will continue to deepen material R&D and process optimization, improve the product matrix, enhance delivery efficiency, empower high-quality industry development with domestic high-end materials, and contribute to the independent controllable construction of the core electronic component supply chain.